Piotr Chołda graduated from AGH University of Science and Technology (Krakow, Poland) as a master of science in networking in 2001. Afterward, he obtained a doctorate in telecommunications in 2006 from the same university. Then, he joined the Department of Telecommunications there, and now he works as an Assistant Professor.
He specializes in design of computer and communications networks. Although his background comes from technology, as he started his research in the reliability modelling and optimization of resilient multi-layer long-haul networks (like the ones based on GMPLS, that is, generalized multi-protocol label switching), later he moved toward softer problems, like the effective provisioning of services to the network clients. Thus, he extended his interests to problems embracing the so-called Quality of Recovery (QoR), resilience-based differentiation in communications/computer networks, and QoS/QoR for peer-to-peer networking. Recently, Piotr has focused on risk-based communications networking, as he perceives this area as a very promising research field, where the interface between business needs and threats from one side and the resilience technology from the other can be used to obtain a practical equilibrium where the balance between client needs and technological possibilities can be found.
He is the co-author of sixteen refereed journal papers and three conference tutorials. He is the recipient of the Communications QoS, Reliability and Performance Modeling Symposium Best Paper Award from ICC’06. He worked on network recovery problems in some of the 6. and 7. FP European Projects (IP Nobel/Nobel II, NoE EuroNGI/EuroFGI/EuroNF, SmoothIT, STAR). He was a Technical Program Committee (TPC) Co-Chair of Communications QoS, Reliability and Modelling Symposium at ICC 2011, a TPC Co-Chair of DRCN 2011, and a TPC Co-Chair of NOMS 2014.
He is a member of the editorial board for IEEE Communications Surveys and Tutorials and leads the Book Review Column in IEEE Communications Magazine.
He is a member of the ACM and IEEE.